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 MITSUBISHI SEMICONDUCTOR
MGFC45V5964A
5.9 - 6.4GHz BAND 32W INTERNALLY MATCHED GaAs FET DESCRIPTION
The MGFC45V5964A is an internally impedance matched GaAs power FET especially designed for use in 5.9 - 6.4 GHz band amplifiers. The hermetically sealed metal-ceramic package guarantees high reliability.
O U T L IN E D R A W IN G U nit:m illim e te rs (inc he s )
24 + /- 0 .3
FEATURES
Internally matched to 50 ohm system High output power P1dB = 32W (TYP.) @ f=5.9 - 6.4 GHz High power gain GLP =9.0 dB (TYP.) @ f=5.9 - 6.4 GHz High power added efficiency P.A.E. = 33 % (TYP.) @ f=5.9 - 6.4 GHz Low Distortion[Item-51] IM3=-45 dBc(TYP.)@Po=34.5dBm S.C.L.
2 M IN
(1 )
R 1 .2
0.6 + /- 0 .1 5
1 7 .4 + /- 0 .2
8 .0 + /- 0 .2
(2 )
2 M IN
(3 )
20 .4 + /- 0 .2
APPLICATION
5.9 - 6.4 GHz band power amplifier
4 .3 + /- 0 .4
0 .1 + /- 0 .0 5
16 .7
QUALITY GRADE
IG
RECOMMENDED BIAS CONDITIONS
VDS = 10 (V) ID = 8 (A) Rg=25 (ohm)
1 .4
G F -38
Refer to Bias Procedure
(1) GATE (2) SOURCE(FIANGE) (3) DRAIN
ABSOLUTE MAXIMUM RATINGS
Symbol VGDO VGSO ID IGR IGF PT Tch Tstg Parameter Gate to drain voltage Gate to source voltage Drain current Reverse gate current Forward gate current Total power dissipation Channel temperature Storage temperature Ratings -15 -15 25 -80 168 150 175 -65 / +175 Unit V V A mA mA W deg.C deg.C
< Keep safety first in your circuit designs! > Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (1)placement of substitutive, auxiliary circuits, (2)use of non-flammable material or (3)prevention against any malfunction or mishap.
*1 : Tc=25 Deg.C
ABSOLUTE MAXIMUM RATINGS
Symbol IDSS Gm VGS(off) P1dB GLP PAE IM3 Parameter Saturated drain current Transconductance Gate to source cut-off voltage Output power at 1dB gain compression Linear power gain Power added efficiency 3rd order IM distortion *1 *2 Delta Vf method Test conditions Min VDS = 3V , VGS = 0V VDS = 3V , ID = 8A VDS = 3V , ID = 160mA -2 44 VDS=10V, ID(RF off)=8A, f=5.9-6.4GHz 8 -42 Limits Typ 24 8 45 9 33 -45 0.8 Max -5 1.0 A S V dBm dB % dBc Deg.C/W Unit
Rth(ch-c) Thermal resistance
*1 : item -51,2 tone test,Po=34.5dBm Single Carrier Level,f=6.4GHz,Delta f=10MHz *2 : Channel-case
MITSUBISHI ELECTRIC
2 .4 + /- 0 .2
June/2004
MITSUBISHI SEMICONDUCTOR
MGFC45V5964A
5.9 - 6.4 GHz BAND 32W INTERNALLY MATCHED GaAs FET TYPICAL CHARACTERISTICS
(Ta=25 Deg.C)
Po , PAE vs. Pin
P1dB ,GLP vs. f
OUTPUT POWER P1dB (dBm)
47 46 45 44 43 42 41
VDS=10(V) IDS=8(A)
14
P1dB
50 VDS=10(V) IDS=8(A) f=6.15(GHz)
Po
50
13 12 11 10 9 8 5.8 5.9 6.0 6.1 6.2 6.3 6.4 6.5
LINEAR POWER GAIN GLP(dB)
OUTPUT POWER Po(dBm)
45
40
40
30
GLP
35
PAE
20
30
10
25 20 25 30 35 40 45
0
FERQUENCY (GHz)
INPUTPOWER Pin(dBm)
Po IM3 vs. Pin 44
OUTPUT POWER Po (dBm S.C.L.)
VDS=10(V) IDS=8(A) f=6.4(GHz) Delta f=10(MHz)
0
Po
42 40 38 36 34 32 30 28 26 24 22 20
-10 -20 -30 -40
IM3
-50 -60 18 20 22 24 26 28 30 32 34 36
INPUT POWER Pin(dBm S.C.L.)
S PARAMETERS
f (GHz) 5.90 6.00 6.10 6.20 6.30 6.40
(Ta=25 Deg.C , VDS=10V , IDS=8A) S Parameters (TYP.) S21 Magn. Angle(deg.) 2.957 3.071 3.119 3.148 3.143 3.122 -44 -62 -81 -100 -118 -137 S12 Magn. Angle(deg.) 0.04 0.05 0.06 0.07 0.08 0.09 -117 -134 -152 -167 175 160 S22 Magn. Angle(deg.) 0.21 0.22 0.25 0.26 0.26 0.25 160 134 112 91 73 55
S11 Magn. Angle(deg.) 0.61 0.55 0.48 0.41 0.34 0.28 159 138 115 92 65 36
MITSUBISHI ELECTRIC
IM3(dBc)
June/2004
POWER ADDED EFFICIECY PAE (%)
MITSUBISHI SEMICONDUCTOR
MGFC45V5964A
5.9 - 6.4GHz BAND 32W INTERNALLY MATCHED GaAs FET
MITSUBISHI ELECTRIC
June/2004


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